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Boiling water makes for cooler electronics

by • May 5, 2016 • No Comments

Boiling water looks a straightforward adequate exercise, you flick on the gas and wait for the bubbles to begin popping. But by manipulating how most of those bubbles look as the temperature rises, scientists have found a new way to finely control how much heat and steam is released in the system, a technique they say may lead to high end cooling systems for additional efficient electronic devices.

Developed by scientists at Oregon State University (OSU), the new method uses a piezoelectric inkjet printing device to print water-repelling polymer dots onto a substrate. On top of this substrate they placed a water-friendly zinc oxide nanostructure, which just grows in spaces where there are no polymer dots.

By altering this hydrophobic-hydrophilic balance of the material, the scientists can exactly control where and when the bubbles form. This in turn allows for them to regulate the boiling and condensation systemes and how much heat is transferred along the way.

By modifying the hydrophobic-hydrophilic balance of the material, the OSU scientists can exactly control bubble formation

These capabilities may come in handy for a couple of reasons. The innovation may be fine-tuned to additional readily release heat and maintain low operating temperatures for applications such as solar energy, high end lasers and other electronics.

“One of the key limitations for electronic devices is the heat they generate, and a thing which assists dissipate which heat can assist them operate at faster speeds and prevent failure,” says Chih-hung Chang, a professor of electrical engineering at OSU. “The additional bubbles you can generate, the additional cooling you can achieve.”

The other promising function of this innovation is its faculty to create steam at lower temperatures. This may see it find uses in clothing irons and industrial boiler systems as a way of boosting their efficiency.

The researchers say they have demonstrated the innovation on sizeable-bodied surfaces and are confident they can be able-bodied to scale it up for commercial use.

Their work was published in the journal Scientific Reports.

Source: Oregon State University


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